Co-packaged Optical Switch Satisfies Chipmakers’ Need For Speed

Stand 742

26th September 2023

ficonTEC’s photonics assembly & test development and inline industrial manufacturing systems have long found favour in the telecom & datacom sector. For this sector, burgeoning internet demand and the corresponding energy budget have required hyperscale device manufacturers to reassess the device architecture, leading ultimately to the embrace of co-packaged optical systems. While 400G optical transceivers are currently being rolled out, 800G and 1.6T development is coming to a close.
The co-packaging approach brings changes in system architecture that require new approaches to manufacture and packaging – ficonTEC systems are embedded in the thick of these developments. Follow the link to find out more …