CCCRAFT Enables Packaging‑Ready PIC Design via Integrated ADK
Stand 2064
13th May 2026
We are proud to announce a dedicated PHIX RF Characterization Package assembly design kit for CCRAFT’s TFLN PICs! This PDK‑level integration was developed in collaboration with PHIX and GDSFactory and enables designers to develop packaging‑ready PIC layouts from day one, using standardized RF and optical interfaces for rapid characterization up to 30 GHz.
Meet CCCRAFT at booth 2064 and PHIX at booth 1051 at ECOC 2026 in Málaga to learn more!

