ECOC

Exhibition 21 - 23 September 2026

Conference 20 September - 24 September 2026

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Exhibitor News

CCCRAFT Enables Packaging‑Ready PIC Design via Integrated ADK

Stand 2064

13th May 2026

We are proud to announce a dedicated PHIX RF Characterization Package assembly design kit for CCRAFT’s TFLN PICs! This PDK‑level integration was developed in collaboration with PHIX and GDSFactory and enables designers to develop packaging‑ready PIC layouts from day one, using standardized RF and optical interfaces for rapid characterization up to 30 GHz.

Meet CCCRAFT at booth 2064 and PHIX at booth 1051 at ECOC 2026 in Málaga to learn more!

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  • Avicena will showcase the world’s first 1Tbps evaluation kit at ECOC 2026

    Stand 1365

    9th September 2026

    Avicena, the pioneer in microLED-based optical interconnects, will showcase its 1 Tbps LightBundle™ evaluation kit at booth #1365 during ECOC 2026. The latest LightBundle eKit...

  • PIC Packaging for Harsh Environments

    Stand 1051

    9th September 2026

    PhotonFirst is a pioneering Dutch photonics company with over two decades of experience turning photonic innovation into reliable, deployable technology. We specialize in advanced PIC...

  • Take photonic chip characterization to the next level with ZEPREN’s OFDR system

    Stand 1344

    9th September 2026

    Designed for high-resolution analysis of integrated photonic structures, it enables detailed characterization of DBR cavities for laser applications, with a spatial resolution down to 2.5...

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