Bridging the fiber to chip gap – with DELO adhesives for reliable coupling and ultra-low signal loss
Stand 1417
13th May 2026
Minimizing coupling loss is a key requirement for the packaging process. DELO’s high-tech adhesives rise to this challenge:
DELO DUALBOND OB6268 excels in coupling fibers to SiPh-chips through its specific properties – such as active alignment with fast UV-fixation, reflow compatibility, RI-matching and minimized shrinkage.
This epoxy achieved 0.2 dB adhesive related signal loss in collaboration with iNEMI. This product is already used successfully by many customers today.
Aside from established products, DELO continuously develops new adhesive solutions adjusted to meet specific customer needs of the future.
Meet us at ECOC 2026 to learn more.