Scalable LightBundle Chiplet Platform for D2D Interconnects

Avicena is collaborating with TSMC to optimize silicon photodetector (PD) arrays for its Lightbundle microLED-based interconnects. Targeted at AI scale-up networks, LightBundle delivers shoreline densities >1Tbps/mm and sub-pJ/bit efficiency. With a >10m reach these interconnects enable ultra-high density die-to-die (D2D) connections to facilitate AI scale-up, overcoming the distance limitations of copper whilst drastically reducing power.

Leveraging TSMC’s expertise in CMOS Image Sensor (CIS) technologies, the chiplets integrate high-performance PD and microLED arrays which are directly bonded to the CMOS IC.

LightBundle supports a versatile range of optical packaging architectures, including co-packaged optics (CPO), on-board optics (OBO), and pluggable optical modules.

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