ASM AMICRA‘s new CoS-Die Bonder is dedicated for Chip on Chip/Carrier/Chip Packaging Solution/Auto Submount Handling and is characterised by a placement accuracy of up to ±3μm@3sigma. It is designed for the markets of Silicon Photonics, Optical Device Packaging, WLP and Direct Bond Interconnect. The CoS-die bonder ensures its placement accuracy by providing a unique dynamic alignment method along with a laser based substrate heating technology. ASM AMICRA’s die bonding technology was specifically designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process.
Find out more: http://www.amicra.com/products/die-flip-chip-bonder