ASM AMICRA ultra high precision die attach technology
7th September 2021
ASM AMICRA is a worldwide leading supplier for ultra-high precision die attach systems. The AMICRA systems specialize in submicron placement accuracy to ±0.3µm@3s for the photonics and semiconductor market. The systems supports die attach, flip chip, eutectic, epoxy, and X-Celeprint’s Micro Transfer Printing (MTP) processes.
Markets served include silicon photonics, optoelectronics, active optical cable (AOC, laser diodes, wafer level packaging (WLP) and automotive sensors/LiDAR. Headquartered in Regensburg, Germany.
AMICRA is a subsidiary of ASM Pacific Technology Limited a leading global supplier of Backend Equipment for semiconductor packaging that is headquartered in Singapore.