ACCµRA OPTO: 0.5 µm Flip-Chip Bonder
30th March 2022
The ACCμRA OPTO by SET is a flip-chip bonder that allows ± 0.5 μm post-bond accuracy.
It is the perfect equipment for optoelectronics and silicon photonics applications.
The ACCµRA OPTO is dedicated to low force and reflow processes. Its motorized axes guarantee a high repeatability of your process.
Combining high precision, flexibility and accessibility, it is already used by many research institutes around the world, such as Ferdinand Braun Institute in Berlin, IMECAS (Institute of Microelectronics of the Chinese Academy of Sciences) in Beijing, ShanghaiTech University.