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High Volume Die Bonding

Created June 2018

MRSI Systems offers a new 3mm die bonder for high volume manufacturing of photonic, sensor, and semiconductor devices. 

The MRSI-HVM3 delivers industry leading speed without sacrificing high precision or superior flexibility, incorporating the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilising dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes, which translates to best-in-class throughput, flexibility and return on investment for our customers. A multi-chip multi-process production, all in one machine. Scale with us. Visit our Booth #577 at ECOC.