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Created June 6, 2017

Albis Optoelectronics recently confirmed further expansion of its portfolio of mounted photodiodes, with the development of its avalanche and pin photodiode portfolio, which can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.

The PS20X4 consists of an array of four, flip-chip soldered 28 Gbps lensed photodiodes that can be used as the core building block inside a 100G ROSA module.

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