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Created June 1, 2017

Teramount has developed a technique to simplify the packaging of silicon photonics chips. Instead of using active alignment whereby an external laser is required to accurately connect a fibre to the chip, the Israeli start-up has developed a passive alignment technique.

“If we want silicon photonics to ramp up to volume, it has to meet CMOS standards both in terms of fabrication and packaging,” says Hesham Taha, co-founder and CEO of Teramount, headquartered in Jerusalem.

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