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OFC 2017: Kaiam, Corning present co-packaged terabit photonic interconnect

Created March 28, 2017

Kaiam and Corning showcased an optical engine and single-mode fibre interface connector suitable for co-packaging with a 12.8Tb/s switch chip at OFC 2017, last week. The partners say that by converting high-speed signals to optical within the switch package, this high-density engine has the potential to cut chip interconnect power consumption in half.

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