3-micron die bonder, from MRSI Systems
Created March 15, 2017
The highly configurable, MRSI-M3 platform provides 3-micron accuracy, automation, speed and reliability, in-situ assembly processes such as eutectic die bonding. UV epoxy die attach and flip chip assembly are also possible.
From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.