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Albis Optoelectronics extends portfolio of mounted photodiodes

Created February 15, 2017

The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers and the PS20X4 consists of an array of four, flip-chip soldered 28 Gbps lensed photodiodes that can be used as the core building block inside a 100G ROSA module. All photodiode products are completely manufactured in-house, in fully owned, clean-room facilities.

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